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|
Technical Capabilities |
| Parameters |
|
Units |
Standard |
Advanced |
Development |
| Materials |
Type |
|
CEM-1, CEM-3, FR4 (Tg: 135°C, 150°C, 170°C, 180°C), |
| |
|
|
Teflon, BT-Epoxy, Aluminium (IMS). Other material on request. |
| Max Panel Size |
Single Sided |
mm |
900 x 600 |
|
|
| (Max used area) |
Aluminium |
mm |
590 x 440 |
|
|
| |
Double Sided |
mm |
605 x 505 |
|
|
| |
Multilayer |
mm |
580 x 500 |
600 x 500 |
|
| Max Base Copper Thickness |
Outer Layer |
µm |
105 |
400 |
|
| |
Inner Layer |
µm |
70 |
105 |
|
| Max Board Thickness |
|
mm |
3.2 |
4 |
5 |
| Min Board Thickness |
|
mm |
0.3 |
0.2 |
0.1 |
| Min Inner Layer Thickness |
|
µm |
100 |
75 |
50 |
| Max Bow & Twist |
|
% |
According to IPC-600 G |
| Max Layer Count |
|
number |
14 |
18 |
22 |
| Min Board Thickness Tol. |
|
% |
10 |
7.5 |
5 |
| Line width/space |
Outer Layer |
µm |
120 |
100 |
80 |
| (Depending on finished Cu) |
Inner Layer |
µm |
100 |
80 |
70 |
| Min annular ring |
Outer Layer |
µm |
250 |
225 |
200 |
| (Depending on finished Cu) |
Inner Layer |
µm |
200 |
175 |
150 |
| Min Clearance Hole to Cu |
|
µm |
300 |
250 |
200 |
| Min Hole size drilled |
|
mm |
0.2 |
0.15 |
0.1 |
| Max Hole size drilled |
|
mm |
6.5 |
6.5 |
6.5 |
| Min Hole size plated |
|
mm |
0.15 |
0.1 |
0.01 |
| Hole Tolerance |
Standard |
+/- µm |
100 |
100 |
100 |
| |
Press-Fit |
+/- µm |
+90/-60 |
+90/-60 |
+90/-60 |
| Hole Location Tolerance |
|
+/- µm |
100 |
100 |
100 |
| Max Aspect Ratio Through Holes for 1,6mm |
number |
8/1 |
10/1 |
12/1 |
| Max Aspect Ratio Blind Via |
|
number |
0.8/1 |
1/1 |
1,1/1 |
| Min Plating Thickness |
|
µm |
According to IPC-6012 B |
| Min Hole size |
Drilled |
mm |
0.2 |
|
|
| |
Punched |
mm |
0.8 |
|
|
| Max Hole size |
Drilled |
mm |
6.5 |
|
|
| Hole Tolerance |
Drilled |
+/- µm |
100 |
50 |
|
| Min Chamfer Depth Tol |
|
+/- % |
10 |
8 |
|
| Hole Location Tolerance |
|
+/- µm |
100 |
100 |
|
| Hole Depth Tolerance |
|
+/- µm |
100 |
50 |
|
| Routing Diameter |
|
mm |
2,0 |
0.8 |
|
| Min Routing Tol |
|
+/- µm |
100 |
75 |
|
| Min Routing Clearance to Cu |
|
µm |
200 |
150 |
|
| Min Tol Depth Routing |
|
+/- % |
10 |
8 |
|
| Min Scoring Tol to Depth |
|
+/- µm |
100 |
75 |
|
| Min Scoring Tol to outline |
|
+/- µm |
200 |
|
|
| Min Scoring Clearance to Pattern |
µm |
400 |
300 |
|
| Bevelling Angle |
|
° |
30 & 45 |
|
|
| Min Solder mask Clearance |
|
µm |
100 |
75 |
50 |
| Min Solder mask Dam |
|
µm |
100 |
80 |
|
| Min Legend Line Width |
|
µm |
200 |
160 |
|
| Legend Line Tol to Solder mask |
µm |
200 |
160 |
|
| Max via Hole Filled |
|
mm |
0.6 |
|
|
| Impedance Control Tol |
|
+/- % |
10 |
8 |
|
| Track Width Tol |
|
+/- µm |
30 |
20 |
|
| Sequent Build Up |
|
µVia build-up |
1 + X + 1 |
2 + X + 2 |
3 + X + 3 |
| HASL PbSn Thickness |
|
µm |
1 - 30 |
|
|
| HASL Sn Thickness |
|
µm |
1 - 30 |
|
|
| OSP Thickness |
|
µm |
0,2 - 0,5 |
|
|
| Electroless Ni/Au Thickness |
|
µm |
5 / 0,1(+/-0,05) |
|
|
| Immersion Sn |
|
µm |
0,3 - 0,6 |
|
|
| Electrolytic Ni/Au Thickness |
|
µm |
5 / 1,5 |
|
|
| (Other Finishing on Request) |
|
|
|
|
|
| Carbon Thickness |
|
µm |
25 |
On demand |
|
| Carbon Min Width/Spacing |
|
µm |
300 |
|
|
| Carbon Min Overhang |
|
µm |
100 |
|
|
| Carbon Resistance Tol |
Laser Trimmed |
% |
3 |
1 |
|
| Peel-off mask Thickness |
|
µm |
250 |
|
|
| Max Coverage Hole size peel-off |
mm |
3 |
|
|
| Max Test area |
|
mm |
600 x 620 |
|
|
| Min Pitch |
|
µm |
100 |
|
|
| Min embedded Resistance test |
Ω |
1 |
|
|
| Max embedded Resistance test |
MΩ |
50 |
|
|
| Max Ionic Contamination |
|
µg |
< 0,3 |
|
|
| Flammabality rating |
See UL file: E75847 |
V-0 |
|
| |
